HMT-X1 Motherboard Layering Chip Glue Removal Heating Table Option:HMT-X1 Small size 36

Small size 36

so it need be sold as a set

48MP version: Advanced camera version

solves the problem of repairing and fixing laptop motherboards

and white background when saving front and rear camera photos and videos caused by non-original front cameras

HMT-X1 Motherboard Layering Chip Glue Removal Heating Table Option:HMT-X1 Small size 36HMT X1 ZJ X1 multi functional motherboard layered chip glue removal heating table for iPhone 16 15 14 13 12 11 X PCB layering tinning repair and chip glue removal. HMT X1 360W universal motherboard delamination and degumming heating table for mobile phone motherboard repair. Features: 1. Temperature control imported from Germany, rapid heating. 2. Turn on the chip degumming station temperature switch, the chip degumming station starts to heat up. 3.